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TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry

Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to both improve productivity/uptime, and to cut down on the costs...

Fri May 17, 2024 21:49
Capsule Review: Sunon Maglev 120mm Fan

Founded in 1980 and headquartered in Taiwan, Sunon (aka Sunonwealth Electric Machine Industry Co., Ltd.), stands out as a prominent global producer of fans, blowers, and thermal management systems. The company has made a name for itself in the fan industry with a comprehensive product line that includes DC brushless fans, micro blowers, CPU coolers,...

Fri May 17, 2024 20:49
Not Dead Yet: WD Releases New 6TB 2.5-Inch External Hard Drives - First Upgrade in Seven Years

The vast majority of laptops nowadays use solid-state drives, which is why the development of new, higher-capacity 2.5-inch hard drives has all but come to a halt. Or rather, it almost has. It seems that the 2.5-inch form factor has a bit more life left in it after all, as today Western Digital has released a slate of new external storage products based...

Fri May 17, 2024 02:40
TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only convert existing capacity to meet...

Fri May 17, 2024 00:41
The Arctic Cooling Freezer 36 ARGB CPU Cooler Review: Budget Cooling Done Well

As modern high-performance CPUs generate more heat, there's been a noticeable increase in the demand for powerful air coolers capable of managing these thermal challenges. Traditional stock air coolers, while sufficient for regular use, are typically designed to be cheap and relatively compact, leaving further improvements to noise control and peak...

Thu May 16, 2024 16:42
TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are going to need to adopt more advanced...

Thu May 16, 2024 15:41

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